Bonding wire ( Cu )
Description
K&S Copper Bonding Wire has been developed for ball/wedge bonding applications as an alternative to gold bonding wire.
Features
Copper Bonding Wire naturally provides higher mechanical strength, higher electrical & thermal conductivity than gold bonding wire. With a higher mechanical strength, it can provide better neck & heel strength, reduce wire sag & sway, and achieve excellent loop stability during encapsulation. In copper bonding applications, a protective gas is necessary to achieve stable and precise oxide-free balls.
Copper wire bonded on aluminum bond pad shows a reduction in the intermetallic growth, which results in lower electrical resistance, lower heat generation and extended bond life.
Copper wire bonded on aluminum bond pad shows a reduction in the intermetallic growth, which results in lower electrical resistance, lower heat generation and extended bond life.
Others
The wire diameters K & S offers range from 0.7mil (18
m) to 4.0mil (100m).
m) to 4.0mil (100m).Inquiry
| Electronic Materials Dept. | 12F Art-Village Osaki Centraltower, 1-2-2 Osaki, Shinagawa-ku, Tokyo 141-0032 TEL:(3)5435-6516 FAX:(3)5435-0071 |