IC tray
IC trays for various package types
Description
We supply a full range of IC trays to meet every user's requirement.
IC trays are used in testing, carrying and shipping QFP, BGA and TSOP.
We offer a range of IC trays designed to withstand various baking temperatures between 60 and 180 degree C.
All are open trays conforming with JEDE standards.
No charge for the initial molding and immediate and Just-in-Time delivery
IC trays are used in testing, carrying and shipping QFP, BGA and TSOP.
We offer a range of IC trays designed to withstand various baking temperatures between 60 and 180 degree C.
All are open trays conforming with JEDE standards.
No charge for the initial molding and immediate and Just-in-Time delivery
Others
Tomoe Engineering represents;
ITW-Camtex (USA, Malaysia)
ITW-Camtex (USA, Malaysia)
Inquiry
| Electronic Materials Dept. | 12F Art-Village Osaki Centraltower, 1-2-2 Osaki, Shinagawa-ku, Tokyo 141-0032 TEL:(3)5435-6516 FAX:(3)5435-0071 |