Bonding wire ( Cu )
DescriptionHeraeus Copper Bonding Wire has been developed for ball/wedge bonding applications as an alternative to gold bonding wire.
FeaturesCopper Bonding Wire naturally provides higher mechanical strength, higher electrical & thermal conductivity than gold bonding wire. With a higher mechanical strength, it can provide better neck & heel strength, reduce wire sag & sway, and achieve excellent loop stability during encapsulation. In copper bonding applications, a protective gas is necessary to achieve stable and precise oxide-free balls.
Copper wire bonded on aluminum bond pad shows a reduction in the intermetallic growth, which results in lower electrical resistance, lower heat generation and extended bond life.
OthersThe wire diameters Heraeus offers range from 0.7mil (18μm) to 4.0mil (10μm).
Electronic Materials Dept.
19F Osaki Bright Core,
5-15, Kitashinagawa 5-chome, Shinagawa-ku, Tokyo 141-0001, Japan