IC trays for various package types
DescriptionWe supply a full range of IC trays to meet every user's requirement.
IC trays are used in testing, carrying and shipping QFP, BGA and TSOP.
We offer a range of IC trays designed to withstand various baking temperatures between 60 and 180 degree C.
All are open trays conforming with JEDEC standards.
No charge for the initial molding and immediate and Just-in-Time delivery.
Electronic Materials Dept.
19F Osaki Bright Core,
5-15, Kitashinagawa 5-chome, Shinagawa-ku, Tokyo 141-0001, Japan