Could not find the products corresponding to the specified search criteria.
To change the search criteria, search and find again.

Electronic materials

Products Machine System

Dicing blade	ADT (Advanced Dicing Technologies) is a world leading provider of comprehensive solutions for complexed dicing applications. ADT has over 40years experience in dicing applications. ADT serves the best dicing solutions for your applications. Choosing the right blade to suit your application is crucial to the success of your dicing process.  ADT’s dicing blade selection is comprised of three product families distinguished by bonding material: resin-bond blades, nickel-bond blades and metal-bond (sintered) blades.
Hub blade	Hub blades for silicon wafers
Capillary	Recognized as the world's leading manufacturer of capillaries for fine-pitch ball bonding applications.
IC tray	IC trays for various package types
Tac Carrier (Gel adhesive sheet)	Tac Carrier is made from gel self-adhesive non-silicone sheet molded with conductive polycarbonate. It is used for industrial precision parts transportation.
Sinter molded Porous plastic products	We supply high quality sinter molded porous products made of different plastics.
Die collets, pick-up tools	We hanlde a variety of pickup tools, from silicon wafer pickup (mounting) in the die bonding process to package pickup.