Tomoe Engineering Co., Ltd.

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Hub blade

Description

Hub blades for silicon wafers

Description

K&S Hub Blades have been developed in response to the IC manufacturers' requirements for improved dicing performance: increased circuit densities, reduced street widths, thinner wafers and higher throughput. K&S Hub Blades provide superior cut quality, blade life and throughput.
 

Features

Hub Blades for silicon wafer dicing
Overall cut quality, blade life and throughput can also be optimized through a flexible blade chemistry and unique production process that allows precise control of diamond grit size, grit concentration and nickel bond hardness.
 
For Today's Most Advanced Silicon Dicing
Increased circuit densities, reduced street widths, thinner wafers and the demand for higher throughput, are just a few of the factors that have led IC manufacturers on quest for improved dicing performance. In response to this need, K & S has developed a flexible blade chemistry and unique, proprietary manufacturing process that allows precise control of diamond grit size, diamond concentration, and nickel bond hardness. By optimization of these variables, in conjunction with blade geometry and process parameters, K&S' Semitec brand of hub blades deliver superior cut quality, blade and throughput.
 
A wide Range of Grit Sizes
Small diamond grit is more readily released from the nickel binder, exposing new diamonds to maintain blade sharpness and minimize chipping. Larger diamonds, on the other hand, provide longer life, are more resistant to loading, and allow higher feed rates. Best performance is therefore obtained by selecting a grit that best meets customer criteria. K&S's Semitec brand blades for silicon are available on a variety of grit sizes, ranging from 2 m-4 m to 4 m-8 m.
 
Variable Bond Hardness
Soft nickel binder releases diamond grit easily, exposing new sharp diamonds to help maintain cut quality. Softer bonds are also less prone to loading. Hard nickel bonds provide greater resistance to wear. In order to obtain the optimum balance between cut quality and blade life, K&S offers four different grades of bond hardness.
 
Choose From 4 Different Diamond Concentrations
Diamond concentration is critical when loading is a concern and larger grits are not suitable. Lower concentrations provide greater resistance to wheel loading, while higher concentrations increase blade life and allow higher feed rates. K&S hub blades are available in four different diamond concentrations to maintain the desired equilibrium between loading, blade life and throughput.
 
AccuKerf Blades
K&S new AccuKerf series of hub blades provide superior kerf control and durability when dicing thick wafers with very narrow streets. Directly replaceable with comparable blades from the Semitec catalog. AccuKerf allow maximization of feed rates and increased productivity.
 
Which Blade Is Best For You?
From any of K&S dicing technology centers around the globe, K&S engineers can analyze your specific requirements and provide comprehensive, tested solutions that include the proper blads, equipment and dicing know-how.
 

AccuKerf

AccuKerf Blade for Thick Wafer/Narrow Street Dicing Application
Maximize feed rate
Reduce blade breakage
Improve cut consistency
Reduce Wmax 
Comparison of Wmax (kerf +chipping)
Constant feed rate & varying spindle speed.
Identical S1030.Q5xH 000 Blades, 600m thick wafer



The chart above illustrates the improvement of the average Wmax and maximum Wmax for an AccuKerf blade in comparison to a standard blade when feed rate is fixed, but spindle speed is varied. Again, the average and maximum Wmax show significant improvement when using Accukerf blades.

Firm in our commitment to cntinuous product improvement, K&S developed AccuKerf Dicing Blades for superior kerf width control and improved blade durability.

Your Dicing Partner Through Thick and Thin
As IC circuit densities and the number of metallization layers continues to increase, semiconductor manufacturers are producing larger, thickener wafers with narrower streets. As a result, applications for thinner dicing blades of higher exposure (length) have become more and more prevalent. 

Comparison of Consistency
Consistent feed rate & spindle speed
S1235-QHH-000 Blades, 600μm thick wafer



The chart above illustrates the improvement of the standard deviation of the average Wmax and maximum Wmax when using an AccuKerf S1235-Q5HH-000 blade. The data shows that both the average and maximum Wmax show significant improvement using AccuKerf.

Blade Breakage Rate
AccuKerf vs. Standard Blades
Destructive testing under aggressive parameters



The chart above compares the blade breakage rate of two different AccuKerf blades to two standard blades when they were tested at very aggressive feed rates. The AccuKerf blades show dramatically reduced breakage compared to the standard blades.

Immediately Reap the Benefits of Greater Cut Consistency and Throughput
As the data shows, AccuKerf dicing blades will pay immediate dividends in improved cut quality and increased throughput. Not only is the average Wmax lower than that of standard Semitec brand blades, but also, the maximum Wmax is reduced for improved cut quality. By comparison, AccuKerf blades are also much more resistant to breakage than standard blades, which allows maximization of feed rates and greater productivity. 

Ordering Information
AccuKerf dicing blades are available in the following thickness and exposures and can be ordered as a direct replacement for comparable Semitec brand blades by replacing the "SH" (Standard Hub) or "00" (AccuCut) designator with the "HH" (AccuKerf) designator in the part number as shown below.

Ordering Information


Other thickness and exposures available upon special request.

Inquiry

Electronic Materials Dept.
19F Osaki Bright Core,
5-15, Kitashinagawa 5-chome, Shinagawa-ku, Tokyo 141-0001, Japan
TEL:(3)3442-5143 FAX:(3)3442-5175

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